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覆銅板材料專業制造商
The professional manufacturer for CCL

制造公司
公司網站 浙江省杭州市余杭區余杭鎮華一路2號
Address: 2# Huayi Road, Yuhang Town, Yuhang District, Hangzhou, Zhejiang
TEL: 86-0571-88650112 http://www.hzccl.com
FAX: 86-0571-88650120 PC: 311121
                   【高性能散熱材料——鋁基覆銅板】
                      Al-Substrate CCL

產品簡介/ Product description
  華正新材鋁基板具有高導熱性、高耐熱性、良好的電絕緣性和極佳的環境可靠性的特點,其導熱系數為傳統覆銅板的4 ~15倍。采用該基板制作的PCB能將電子元件產生的熱量經由基板結構,快速傳導至后端散熱基座或其他散熱模組。其結構由銅箔電路層、導熱絕緣層以及金屬基板所組成,導熱層是由特殊的高分子樹脂和導熱填充料制作而成,相關產品已通過多項苛刻的長時間環境測試,獲得國際認證。
  華正新材擁有強大的研發實力,相續開發出多款高性能鋁基板產品。熱導率為1.0~5.0 W/ m?K,可滿足中高端產品需求,性價比高。所有產品均通過RoHS等國際規范的禁用物質檢驗,兼顧良好的產品特性與低碳環保之趨勢。
  Thermal conduct Al-Substrate CCL provides the advantages of high thermal conductivity, Excellent solder heat endurance, Excellent Breakdowm Voltage, reliability, Thermal Conductivity is about four~ fifteen times higher than the FR-4 , PCB produced by the substrate can transfer heat , which is electrionic components generate , throughing the substrate structure rapid conduct to the back-end cooling base or other cooling modules.
Al-Substrate CCL is a sandwich structure, which includes layers of conductor ,insulator and metal base. In genaral, this insulator is made of epoxy resin and high thermal Conductivity filler. The products have been through a number of demanding for a long time environmental testing, access to international certification.
Huazheng new material has a strong R&D strength, which continued to develop avariety of high Thermal Conductivity products. Thermal conductivity 1.0~5.0 W/ m?K,It can fit the demand of high end and mid-range products,with high cost performance. All products pass RoHS standard, have good property andmeet low-carbon environmental trend.

特性/ Features
  優異的散熱性能 Excellent thermal conductivity
  電氣絕緣性能佳 Excellent Breakdowm Voltage
  符合RoHS要求 RoHS compliance
  良好的耐熱性能 Excellent solder heat endurance
  良好的機械加工性能 Excellent mechanical properties
  電磁屏蔽性能 Excellent electromagnetic shielding
  可直接外接散熱裝置 Can use external cooling device directly
  優良的性價比 High cost performance

基本結構/ Basic Structure
                        典型結構
  

                單面鋁基板single Al-Substrate CCL
  
  單面鋁基板產品能夠針對各種銅厚、絕緣層特性、金屬板規格需求,提供符合客戶要求的高性能產品;
  Single Al-Substrate CCL offers various kinds ouf combination of base metal,copper foil,and dielectric layers to meet the general requirement of single layer thermal conductive printed circuit board

                雙面鋁基板Double Al-Substrate CCL
  
  雙面鋁基板產品其為導熱絕緣層雙面黏貼銅箔的結構,適用于一般用途多層板。
  Double Al-Substrate CCL is good for general requirement ouf multilayer or thineer shape printed circuit board. ACCL is a sandwich structure, which includes layers of copper foil, thermal conductive dielectric layer.l

說明 / Instruction
  
導電層—電解銅箔 / Circuit Layer – Electrolysis copper foil
  導熱絕緣層—以最小的熱阻提供電學上的絕緣,分為玻璃布增強型和無玻璃布增強型兩種
  Thermally Conductive Dielectric Layer –This offers electrical isolation with minimum thermal resistance. two types: Fiberglass support & non-fiberglass support.
  鋁基層—是整個結構的支撐和熱量的發散,材料為鋁合金板
  Aluminum SubstrateIt –supports the entire structure and conducts the heat. The material is aluminum alloy plate.

應用領域 / Application
  照明、LED顯示 LED lighting、Public lighting、Backlight module、outdoor LED display
  汽車應用   Automotive (Vehiche lighting、regulator、converters、Power module)
  工業電子   Industrial electronics(DC-DC converter、Power supplies、Solid-State Relays transistor modules)
  通訊產品   Digital、PC、Audio
  需要高散熱的領域 The area needs high heat dissipation
  

產品分類 /Type
  Type1:普通型,一般應用在家用照明、戶外顯示屏、背光源領域
  General purpose. It is used widely in consumer lighting、outdoor LED display and backlight applications
  Type2:標準導熱型,廣泛應用在公用照明、通訊數碼、汽車應用領域
  Standard thermal conductivity. It is used in public lighting、Digital、PC、Audio、Automotive applications
  Type3:高導熱型,應用在大功率、亮度LED、汽車應用、工業電子領域
  High thermal conductivity. It is used in high power LED lighting、Automotive applications、Industrial electronics
  Type4:高導熱低熱阻型,可使用需要高導熱及高功率方面
  High thermal conductivity、Low thermal resistance. It is used in high power applications
  Type5:高韌性型,具有良好的折彎性能,應用在非平面空間領域;
  High toughness. It is used in the field of no-plat, with good bending properties.

主要性能 Main property 表Table1

項目 Item

處理條件
Test condition

單位 Units

指標值
Spec

典型值 Typical Value

類型 1

類型 2

類 型 3

類型 4

類型 5

Type1

Type2

Type3

Type4

Type5

1.0 瓦

1.5 瓦

2.0 瓦

3.0 瓦

2.0 瓦

熱阻 * Note 1
thermal resistance

ASTM E-1461

K·cm2/W

< 1.0

0.77

 

 

 

 

< 0.7

 

0.61

 

 

 

< 0.5

 

 

0.41

 

0.41

< 0.4

 

 

 

0.33

 

熱導率 * Note 1 ThermalConductivity

ASTM E-1461

W/m·K

≥1.0

1.1

 

 

 

 

≥1.5

 

1.6

 

 

 

≥2.0

 

 

2.2

 

2.2

≥3.0

 

 

 

3.0

 

剝離強度 1OZ
Peel Strength

熱應力前

N/mm

≥1.2

1.82

1.83

1.80

1.75

1.80

熱應力后

1.75

1.73

1.76

1.70

1.76

熱應力
Thermal Stress

288 ℃ ,solder dip

S

≥120

180S No delamination

300*10s/cycle solder dip

cycle

≥6 次

6 次 No delamination

表面電阻 Surface Resistivity

C96/35/90

≥104

106

106

106

106

106

E-24/125

≥10 3

105

105

105

105

105

體積電阻 Volume Resistivity

C96/35/90

MΩ·cm

≥106

107

107

107

107

107

E-24/125

≥103

105

105

105

105

105

擊穿電壓( AC )
* Note 2 空氣環境Dielectric Breakdown

IPC-TM-650 2.5.6 .2

KV

≥3

100μm

4.3

4.3

4.3

4.3

4.3

≥4

125μm

5.0

5.0

5.0

≥5

150μm

6.0

6.0

6.0

介電常數( 1MHz ) Dielectric Constant

C 24/23/50

5.1

5.3

5.5

5.8

5.5

IPC-TM-650 2.5.5 .2

耐電弧
Arc Resistance

D48/50 + D0.5/23

S

≥60

120

120

120

120

120

IPC-TM-650 2.5.1

燃燒性 Flammability

E-24/125

V-0

V-0

V-0

V-0

V-0

V-0

玻璃化溫度 Tg

DSC

≥110

121.2

122.6

121.8

122.3

121.8

熱分解溫度 Td

TGA ( Wt5%loss )

≥360

400

400

400

400

400

吸水率
Water Absorption

D-24/23

%

≤1.5

0.51

0.43

0.56

0.49

0.56

IPC-TM-650 2.6.2 .1

CTI

IEC60112

V

≥600

600

600

600

600

600

  上述測試數據為典型值而非保證值。
  *備注1:熱阻試樣采用鋁合金板厚度1.0mm、銅箔厚度35um、絕緣層厚度75um的鋁基板試樣測試并計算所得(引用標準:CPCA4105-2010《印制電路用金屬基覆銅箔層壓板》行業標準)。
  *Note1:Thermal resistance samples use Aluminum SubstrateIt with 1mm aluminium alloy plate,35um copper foil and 75um Dielectric layer, Using ASTM E-1461 test method and calculate the result(According to CPCA4105-2010《 Printed Circuit Metal Base Copper-Clad Laminate 》).
  *備注2:絕緣層耐電壓測試值采用鋁基覆銅板測試所得,而非制作成PCB的測試值。由于客戶線路設計及空氣導電等因素,MPCB的測試值會低于基板的值。
  *Note2:Dielectric Breakdown Voltage test value refers to the value of Al-Substrate CCL,and not Al-Substrate PCB test value. Because of design and the air facor, the Al-Substrate PCB test value will be lower than the value of substrate.

絕緣層厚度與耐電壓關系Relationship of Dielectric Layer Thickness and Breakdown Voltage
              

產品規格Specification

標準尺寸 Standard Size

500×610mm 、 550×610mm 、 500×1220mm 、 550×1220mm
1000×1220mm 、 1100×1220mm

導電層 Circuit Layer(電解銅箔 Copper foil)

18μm、35μm、70μm、105μm(Hoz、1oz、2oz、3oz)

導熱絕緣層厚度Dielectric Layer Thickness

100μm、125μm、150μm(1.0~2.0 瓦)100μm(non-fiberglass support)

鋁基板厚度 Thickness

0.6mm 、 0.8mm 、 1.0mm 、 1.2mm 、 1.5mm 、 1.6mm 、 2.0mm 、 3.0mm (厚度≤ 1.0 或 3oz 銅箔建議鋁型選用 5052 )

鋁板類型及處理方法 Aluminum Substrate Type

1100 、 1060 、 5052 、 6061 陽極氧化法 Anodization

保護膜類型 Masking Film

PET 、 PI

  如有特殊要求,可定制any specific inquuiry could be available upon request。

可靠性測試數據/ ReliabilityTesting Data
  測試基板:HA50-type3(鋁板厚度:1.4mm,絕緣層厚度:100μm,銅箔厚度:1oz)
  Tested substrate: HA50-type3 (Aluminum thichness: 1.4mm, thermal conductive dielectric layer thinckness: 100μm, copper foil thinckness: 1oz)
  (1) 絕緣層耐電壓測試 Dielectric Breakdown Voltage
  HA50產品在經過漂錫后以及長期環境冷熱沖擊后仍然可保持良好的耐電壓特性。
  HA50 product has excellent dielectric Breakdown Voltage even after solder dippling
圖1.漂錫測試260℃
Figure 1. Breakdown Voltage after aging test at 260℃
圖2.冷熱環境測試-40℃/30min至150℃/30min
Figure 2. Breakdown Voltage after aging test at -40℃/30min&150℃/30min

  (2) 剝離強度測試 Peeling Strength
  HA50產品在經過漂錫后以及長期環境冷熱沖擊后仍然可保持良好的剝離強度。
  HA50 product has excellent Peeling Strength even after solder dippling
圖3.漂錫測試260℃
Figure 1. Breakdown Voltage after aging test at 260℃
圖4.冷熱環境測試-40℃/30min至150℃/30min
Figure 2. Breakdown Voltage after aging test at -40℃/30min&150℃/30min
   


 

 

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